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8 Layers HDI PCB
Content
Application: Pad
Layers: 8
Stack: 1+6+1
Thickness: 1.6 mm
Min.track Space/width: 4mil /4mill
Min. CNC Via size: 0.2mm
Laser drill : 0.1mm
Layers: 8
Stack: 1+6+1
Thickness: 1.6 mm
Min.track Space/width: 4mil /4mill
Min. CNC Via size: 0.2mm
Laser drill : 0.1mm
HDI PCB Capabilities
| Item | Capabilities |
|---|---|
| Layers | 4 - 48 Layers |
| HDI Step | 4+N+4 |
| Min.Line Width | 0.05mm (2 mil) |
| Min.Line Space | 0.05mm (2 mil) |
| Min.Annular ring | 0.1mm (4 mil) |
| Min. Via | 0.1mm (4 mil) |
| Max.Size | 500mm X 800mm |
| Material | FR4,High Tg220 |
| Material thickness | Start at 25um Plus copper |
| Copper thickness | 0.3 OZ to 10 OZ (10um - 350um) |