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telecom amplifier
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Technical Parameters
Layer count: 2
Board thickness：0.68mm
Dimension：249.8*146.3mm
Raw material：Rogers（R04350B)
Copper thickness on the board surface：≥45um
Copper thickness in the hole barrel：25um
Min.line width/space：0.38mm
Minimum hole diameter：0.3mm
Surface finishing：immersion silver, 5-12 microinch
Application：telecom amplifier
Layer count: 2
Board thickness：0.68mm
Dimension：249.8*146.3mm
Raw material：Rogers（R04350B)
Copper thickness on the board surface：≥45um
Copper thickness in the hole barrel：25um
Min.line width/space：0.38mm
Minimum hole diameter：0.3mm
Surface finishing：immersion silver, 5-12 microinch
Application：telecom amplifier